● High Thermal Conductivity: 1.2W/m.k ensuring effective heat transfer and dissipation
● Strong Adhesion: Delivers excellent bonding strength to diverse surfaces
● Temperature Resilience: Capable of withstanding extreme high and low temperatures
● Flexibility and Conformability: Adapts easily to various surface contours and shapes
● Thin Profile: At 0.3mm thickness it provides efficient thermal management without occupying significant space
1 Surface Preparation: Ensure the surfaces to be bonded are clean dry and free from dust grease and other contaminants
2 Tape Application: Cut the tape to the required size and remove the protective liner
3 Positioning: Accurately position the tape on the target surface avoiding wrinkles and air bubbles
4 Pressure Application: Apply firm and even pressure to the tape to secure a strong bond and optimal contact
5 Curing (if required): Allow the adhesive to cure for the specified time to achieve maximum bonding strength
