2.0 W/m.K Two-component Thermal Gel High Thermal Conductivity for Electronics Cooling NFION

2.0 W/m.K Two-component Thermal Gel High Thermal Conductivity for Electronics Cooling NFION

  • 2.0 W/m.K Two-component Thermal Gel High Thermal Conductivity for Electronics Cooling NFION
  • 2.0 W/m.K Two-component Thermal Gel High Thermal Conductivity for Electronics Cooling NFION
Summary
NFION 2.0 W/m.K Two-component Thermal Gel is a high-performance thermal interface material engineered for advanced heat dissipation in high-demand electronic systems. With a thermal conductivity of 2.0 W/m.K and low thermal resistance, this two-component thermal gel ensures efficient thermal management across a wide temperature range (-50~160℃). Ideal for applications in energy storage, battery systems, and power electronics, it offers excellent stability, non-corrosive properties, and high dielectric strength. The 1:1 mixing ratio and dual-curing options (15 minutes at 100℃ or 24 hours at 25℃) enable flexible and reliable integration into automated processes, making it a superior choice for next-generation thermal solutions in the新能源 industry.More
Specifications
Thermal Conductivity:
2.0W/M.K
Mixing Ratio:
A:B=1:1
Curing Time:
15min (100℃), 24H (25℃)
  • 2.0 W/m.K Two-component Thermal Gel High Thermal Conductivity for Electronics Cooling NFION
Thermal Conductivity:2.0W/M.K
Mixing Ratio:A:B=1:1
Curing Time:15min (100℃)
Curing Time:24H (25℃)
Temperature Range:-50~160℃
Certification:UL,ROHS,REACH
Thermal Conductivity:2.0W/M.K
Mixing Ratio:A:B=1:1
Curing Time:15min (100℃)
Curing Time:24H (25℃)
Temperature Range:-50~160℃
Certification:UL,ROHS,REACH

High Thermal Conductivity: Provides excellent thermal conductivity of 2.0 W/m.K for efficient heat transfer.

Low Thermal Resistance: Reduces thermal impedance, enhancing overall thermal management.

Curing Characteristics: Transforms from a gel to a solid state upon curing, offering secure adhesion and consistent thermal performance similar to thermal silicone pads.

Excellent Stability: Retains performance across a wide temperature range, ensuring long-term reliability.

Non-Corrosive and Non-Conductive: Safe for use with delicate electronic components.

High Dielectric Strength: Offers superior electrical insulation properties.

Automated Dispensing Compatibility: Suitable for use with automatic dispensing equipment, facilitating precise and efficient application.

Surface Preparation: Clean the surfaces thoroughly to remove any dust, grease, or contaminants.
Mixing: Combine the two components of the thermal gel according to the specified ratio.
Application: Apply the mixed gel evenly on the desired surfaces using automatic dispensing equipment or manually.
Curing: Allow the gel to cure under the recommended conditions to achieve optimal performance.
Consumer Electronics: Perfect for thermal management in smartphones, tablets, laptops, and other portable devices. Automotive Electronics: Ideal for use in automotive control units, LED headlights, battery management systems, and other automotive electronics. Telecommunications: Effective in managing heat in base stations, routers, servers, and other telecommunications equipment. Industrial Equipment: Suitable for thermal management in power supplies, motor controls, and various industrial electronic devices. Medical Devices: Ensures efficient heat dissipation in diagnostic and monitoring equipment.
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