Stable and Reliable 532 Laser: At the heart of the HAN'S LAESE lies a 532nm green laser, renowned for its stability and reliability. This laser source ensures consistent and precise energy delivery, crucial for achieving uniform doping profiles across the entire wafer surface.
Innovative Optical Path Design: The machine boasts a newly designed focusing flat-top energy distribution optical path transmission system. This innovative design significantly improves optical path stability, minimizing potential damage to the silicon substrate during the doping process. It ensures that each wafer receives uniform and exposure, resulting in superior doping outcomes.
Seamless Integration with Existing Production Lines: Recognizing the importance of compatibility, the HAN'S LAESE Laser Doping Machine is designed to seamlessly integrate with existing semiconductor production lines. This feature not only simplifies the upgrade process but also ensures minimal disruption to ongoing operations, maximizing productivity and reducing downtime.
High Reliability and Easy Upgrades: The machine's robust construction and precision engineering guarantee long-term reliability, reducing maintenance costs and enhancing overall. Moreover, its modular design facilitates easy upgrades, ensuring that your investment remains future-proof and capable of adapting to evolving industry standards and requirements.
In conclusion, the HAN'S LAESE Laser Doping Machine stands as a testament to innovation and excellence in semiconductor manufacturing. Its unique combination of advanced laser technology, precision engineering, and seamless integration capabilities makes it the ideal choice for manufacturers seeking to enhance the quality and efficiency of their doping processes. With the HAN'S LAESE, you can unlock new semiconductor device production, driving your business forward in a competitive market.
| Event | Technical indicators |
| Spot shape and size | Flat top square light spot, uniform energy distribution, minimize silicon-based damage, 80 - 140um adjustable |
| Processing battery | 1 56mmx1 56m to 185mmx185m, and 210 m. |
| Machine capacity | 7500 ～8000p/ h@166mm (standard machine); 12000p/ h@166mm (customizable) |
| Laser life | 2000 hours |
| Fragment rate | ≤0 .03% |
| Slice detection | Pre inspection industrial camera, ≥ 10 million pixels; Optional for post inspection |
| Graphic accuracy | ≤±1 5 u m |
| positioning accuracy | Positioning deviation |
| Operation mode | Double track operation, the two tracks are independent of each other and do not interfere with each other |
| Dust removal and filtration efficiency | The dust removal efficiency is greater than 95%, and the dust filtration efficiency is greater than 99% |
| Feeding mode | Loading and unloading on both sides / on the same side is optional |
| Control system | PLC + industrial computer |
| Interactive interface | LCD display, touch operation, online monitoring, authority management, etc |
| MES | With MES information interface |
