HFC Graphene Series High-Conductivity Thermal Interface Material for High-Power Chip Thermal Management

HFC Graphene Series High-Conductivity Thermal Interface Material for High-Power Chip Thermal Management

  • HFC Graphene Series High-Conductivity Thermal Interface Material for High-Power Chip Thermal Management
  • HFC Graphene Series High-Conductivity Thermal Interface Material for High-Power Chip Thermal Management
Summary
HFC Graphene Series High-Conductivity Thermal Interface Material delivers superior thermal management for high-power and large-area chips. Featuring directional arrangement technology, it provides a continuous heat conduction path with thermal conductivity over 10 times higher than conventional TIMs. This lightweight, high-resilience solution ensures zero spillage and exceptional reliability, ideal for advanced chip packaging and high-performance electronic applications in the新能源 industry.More
  • HFC Graphene Series High-Conductivity Thermal Interface Material for High-Power Chip Thermal Management
Product features
  • Solve the heat dissipation problem caused by high-power/large-area chip warpage
  • Directional arrangement technology is used to provide a continuous heat conduction path
  • The thermal conductivity is more than 10 times that of conventional thermal interface materials
  • It has the innovative advantages of high reliability, low density, high resilience and zero spillage
  • Typical Applications
  • LSI
  • High-power chips/devices
  • Advanced Chip Packaging (TIMI)
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