Product features
Solve the heat dissipation problem caused by high-power/large-area chip warpageDirectional arrangement technology is used to provide a continuous heat conduction pathThe thermal conductivity is more than 10 times that of conventional thermal interface materialsIt has the innovative advantages of high reliability, low density, high resilience and zero spillage Typical Applications
LSIHigh-power chips/devicesAdvanced Chip Packaging (TIMI)