YIFI Laser scribing is performed after the deposition of the transparent conductive oxide (TCO) layer and before the deposition of the charge transport layer, in order to form electrically isolated strip-shaped conductive electrodes. The process requires no substrate damage or residue within the scribed grooves.
Real-time focal tracking and laser energy monitoring for consistent process control
Smart control software with customizable process parameters and UI
Flexible configuration with 8-head, 12-head, or 24-head multi-channel setups
≥98% equipment availability with low maintenance requirements and stable performance
Precision machining for ultra-fine lines: Line width adjustable from 10–30 μm, depth ≤50 nm
P1 scribing in thin-film solar modules (CIGS, CdTe, perovskite)
Electrode patterning for flat panel displays
Micromachining of conductive films on glass or flexible substrates
Advanced materials processing in battery, semiconductor, and photonic devices
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