Silicone Thermal Putty 1.0W/m.k High Thermal Conductivity Gap Filling Material for Battery Systems

Silicone Thermal Putty 1.0W/m.k High Thermal Conductivity Gap Filling Material for Battery Systems

  • Silicone Thermal Putty 1.0W/m.k High Thermal Conductivity Gap Filling Material for Battery Systems
  • Silicone Thermal Putty 1.0W/m.k High Thermal Conductivity Gap Filling Material for Battery Systems
Summary
1.0W/m.k Silicone Thermal Putty is a high-performance thermal interface material designed for advanced thermal management in energy storage and battery systems. Offering excellent thermal conductivity, this non-curing, silicone-based putty ensures efficient heat dissipation and reliable performance across a wide temperature range (-40~200℃). Its superior gap-filling capability minimizes thermal resistance, making it ideal for use in high-power battery modules, electric vehicles, and renewable energy systems. Compatible with automated dispensing, it enhances manufacturing efficiency while ensuring long-term durability and operational stability in demanding applications.More
Specifications
Material:
Silicone
Thermal Conductivity:
1.0W/m.k
Temperature Range:
-40~200℃
  • Silicone Thermal Putty 1.0W/m.k High Thermal Conductivity Gap Filling Material for Battery Systems
● Single-Component: Simplifies the application process with no mixing required.
Non-Curing: Remains pliable and can be reapplied or adjusted as needed.
Automated Dispensing: Compatible with automated dispensing systems, ensuring precise application and efficiency.
High Thermal Conductivity: With a thermal conductivity of 1.0 W/M.K, it ensures excellent heat dissipation.
Excellent Gap Filling: Fills gaps and voids effectively, providing uniform thermal contact.
Wide Operating Temperature Range: Maintains performance across a broad temperature range, ensuring reliability in various conditions.
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