● High Thermal Conductivity: Efficiently transfers heat to ensure optimal performance and longevity of electronic components.
● Strong Adhesion: Provides excellent bonding strength to various surfaces ensuring durability and stability.
● Flexibility and Conformability: Easily conforms to irregular surfaces and contours for versatile application.
● Thin Profile: At just 0.15mm thick it allows for compact and efficient heat management solutions.
1、Surface Preparation: Ensure that the surfaces to be bonded are clean dry and free from dust and grease.
2、Tape Application: Cut the tape to the desired length and remove the protective liner.
3、Positioning: Carefully position the tape on the target surface ensuring alignment and avoiding wrinkles or air bubbles.
4、Pressure Application: Apply firm pressure to the tape to ensure good adhesion and contact with the surface.
