● Dual-Sided Adhesion: Offers strong bonding on both sides, ensuring reliable thermal interface
● High Thermal Conductivity: Efficiently transfers heat with a thermal conductivity of 1.2W/m.k
● Temperature Tolerance: Operates effectively in a wide temperature range from -20 to 120℃
● Tear Resistance: Enhanced durability with resistance to tearing, thanks to the fiberglass base
● Robust Adhesion: Provides superior adhesion strength to a variety of surfaces
● Flexibility and Conformability: Easily conforms to irregular surfaces for comprehensive coverage
- Surface Preparation: Clean and dry the surfaces to be bonded, ensuring they are free from dust, oil, and contaminants
- Tape Cutting: Cut the tape to the appropriate size for your application
- Peeling and Placement: Peel off the protective liners from both sides of the tape and position it between the heat-generating component and the heat sink or other surfaces
- Pressure Application: Apply firm pressure to ensure full contact and secure adhesion
- Curing Time: Allow the adhesive to set as per the manufacturer's recommendations to achieve optimal performance
● Power Electronics: Ideal for use in power converters and modules where efficient heat transfer is critical
● Computer Components: Enhances thermal management in CPUs, GPUs, and other high-performance computing elements
● Consumer Electronics: Applied in smartphones, tablets, and other devices to manage heat effectively
● Industrial Machinery: Ensures reliable heat dissipation in various types of industrial equipment
● Telecommunications Hardware: Manages heat in communication devices and networking equipment
