VINcoPACK E3 Sixpack Power Module 1200V 100A Inverter Kelvin Emitter Temperature Sensor for Energy Storage and Industrial Applications Vincotech

VINcoPACK E3 Sixpack Power Module 1200V 100A Inverter Kelvin Emitter Temperature Sensor for Energy Storage and Industrial Applications Vincotech

Vincotech China
  • VINcoPACK E3 Sixpack Power Module 1200V 100A Inverter Kelvin Emitter Temperature Sensor for Energy Storage and Industrial Applications Vincotech
  • VINcoPACK E3 Sixpack Power Module 1200V 100A Inverter Kelvin Emitter Temperature Sensor for Energy Storage and Industrial Applications Vincotech
  • VINcoPACK E3 Sixpack Power Module 1200V 100A Inverter Kelvin Emitter Temperature Sensor for Energy Storage and Industrial Applications Vincotech
  • VINcoPACK E3 Sixpack Power Module 1200V 100A Inverter Kelvin Emitter Temperature Sensor for Energy Storage and Industrial Applications Vincotech
Summary
VINcoPACK E3 Sixpack Power Module 1200V 100A is a high-performance inverter module designed for energy storage and industrial applications. Featuring Kelvin Emitter technology for enhanced switching performance, a built-in temperature sensor, and optimized EMC compatibility, this Vincotech power module ensures reliable operation with low switching losses and high efficiency. Ideal for industrial inverters and renewable energy systems.More
  • VINcoPACK E3 Sixpack Power Module 1200V 100A Inverter Kelvin Emitter Temperature Sensor for Energy Storage and Industrial Applications Vincotech
  • VINcoPACK E3 Sixpack Power Module 1200V 100A Inverter Kelvin Emitter Temperature Sensor for Energy Storage and Industrial Applications Vincotech
Additional information
  • Equivalent: IFX FS100R12KT4G_B11

Product details

Topology: Sixpack
  • Inverter
  • Kelvin Emitter for improved switching performance
  • Temperature sensor
Chip technology (main switch): IGBT M7
  • Easy paralleling
  • Low turn-off losses
  • Low collector emitter saturation voltage
  • Positive temperature coefficient
  • Short tail current
  • Switching optimized for EMC
Base isolation (e.g. ceramic): IMB
Electrical interconnection: Press-fit pin

Housing related details

Module housing: VINco E3
Mechanical connection to the PCB: 4 towers
Footprint: 122 mm x 62 mm
Height: 17 mm
  • SoLid Cover Technology
  • Standard mid-power industry package
  • Avaliable with press-fit and solder-pin
  • Reliable cold welding connection to PCB
  • Press-fit terminals
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