China
| Topology: | Sixpack |
|---|
| Chip technology (main switch): | IGBT M7 |
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| Base isolation (e.g. ceramic): | IMB |
|---|---|
| Electrical interconnection: | Press-fit pin |
| Module housing: | VINco E3 |
|---|---|
| Mechanical connection to the PCB: | 4 towers |
| Footprint: | 122 mm x 62 mm |
| Height: | 17 mm |


